Organic MK II Interconect
Custom copper architecture without weak points
The Organic MK II interconnect eliminates the traditional brass bottleneck by using 99.999% OFC copper from ribbon conductor through custom connector contacts, achieving direct copper-to-copper interfaces without solder while DAD (Damped Air Dielectric) maintains minimal capacitance through reduced fiber mass.
Construction
- Direct copper-to-copper interfaces without solder on XLR and RCA positive connections
- Cryogenic treatment of all connector components
- Geometry optimized for low capacitance throughout
- Further reduced dielectric mass for minimal conductor interaction
- Custom-designed connectors specifically engineered for each cable type
- Argento-level fit and finish standards
Materials
- 99.999% pure OFC annealed copper ribbon conductors throughout
- Custom connectors with contacts made from the same 99.999% OFC copper—no brass or copper alloys
- Teflon (PTFE) dielectric in all connectors for lowest dielectric constant
- DAD (Damped Air Dielectric)—low-mass fibers with minimal conductor contact
- Machined Delrin/POM polymer connector housings with laser engraving
- Zero shielding for minimum capacitance